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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12230597 B1

PDFFull Text
Date of Patent:
Feb. 18, 2025

Filed:

Jun. 16, 2023

Package structure with warpage-control element

Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Hao-Jan Pei, Hsinchu, TW;

Chih-Chiang Tsao, Taoyuan, TW;

Wei-Yu Chen, Taipei, TW;

Hsiu-Jen Lin, Zhubei, TW;

Ming-Da Cheng, Taoyuan, TW;

Ching-Hua Hsieh, Hsinchu, TW;

Chung-Shi Liu, Hsinchu, TW;

Assignee:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

Nikolay K Yushin

Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H01L 25/10 (2006.01); H01L 25/11 (2006.01);
U.S. Cl.
CPC ...
H01L 24/19 (2013.01); H01L 21/565 (2013.01); H01L 21/6835 (2013.01); H01L 23/293 (2013.01); H01L 23/3128 (2013.01); H01L 24/13 (2013.01); H01L 24/25 (2013.01); H01L 24/73 (2013.01); H01L 24/96 (2013.01); H01L 25/105 (2013.01); H01L 25/115 (2013.01); H01L 2221/68345 (2013.01); H01L 2221/68368 (2013.01); H01L 2224/13024 (2013.01); H01L 2224/19 (2013.01); H01L 2224/25171 (2013.01); H01L 2224/2518 (2013.01); H01L 2224/73209 (2013.01); H01L 2225/1035 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/3511 (2013.01);
Abstract

A package structure is provided. The package structure includes a semiconductor chip and a protective layer laterally surrounding the semiconductor chip. The package structure also includes a polymer-containing element over the protective layer. The protective layer is wider than the polymer-containing element.

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Pei, Hao-Jan. (2025). Package structure with warpage-control element (U.S. Patent No. 12230597). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12230597

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