The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 24, 2026
Filed:
Nov. 29, 2023
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Hao-Jan Pei, Hsinchu, TW;
Ching-Hua Hsieh, Hsinchu, TW;
Hsiu-Jen Lin, Hsinchu County, TW;
Wei-Yu Chen, Taipei, TW;
Chia-Shen Cheng, Hsinchu County, TW;
Chih-Chiang Tsao, Taoyuan, TW;
Jen-Jui Yu, Taipei, TW;
Cheng-Shiuan Wong, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Abstract
A method of manufacturing a package structure at least includes the following steps. An encapsulant laterally is formed to encapsulate the die and the plurality of through vias. A plurality of first connectors are formed to electrically connect to first surfaces of the plurality of through vias. A warpage control material is formed over the die, wherein the warpage control material is disposed to cover an entire surface of the die. A protection material is formed over the encapsulant and around the plurality of first connectors and the warpage control material. A coefficient of thermal expansion of the protection material is less than a coefficient of thermal expansion of the encapsulant.