Chia-Shen Cheng

This inventor holds 31 USPTO granted patents and 22 published patent applications, primarily in Semiconductor Packaging. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2016-2026.

USPTO Granted Patents = 31 (Patent Applications = 22)

% Patents Active = 96.8

Average Co-Inventor Count = 8.3

ph-index = 4

Forward Citations = 43(Granted Patents)

Location History:

Hsin-Chu, TW (2016 - 2024)
Hsinchu County, TW (2020 - 2024)
Zhubei, TW (2024)

Company Filing History:

31 out of 42,810

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

Years Active: 2016-2026

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Areas of Expertise:

Reflow Method

Multi-Shot Laser Bonding

Package Structure

Integrated Fan-Out Packages

Heat Dissipation

Wafer Handling

Dicing Techniques

Electronic Device Manufacturing

31 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12649194 - Reflow method and system (2026-06-09),

2. 12581977 - Bonding through multi-shot laser reflow (2026-03-17),

3. 12564055 - Package structure and method of fabricating the same (2026-02-24),

4. 12564054 - Package structure (2026-02-24),

5. 12489030 - Methods of manufacturing integrated fan-out packages with embedded heat dissipation structure (2025-12-02),

6. 12368149 - Methods of forming semiconductor packages (2025-07-22),

7. 12368053 - Method for laser drilling process for an integrated circuit package (2025-07-22),

8. 12266559 - Method of manufacturing semiconductor package, method of handling wafer, and method of handling workpiece (2025-04-01),

9. 12176319 - Reflow method and system (2024-12-24),

10. 12040309 - Bonding through multi-shot laser reflow (2024-07-16),

11. 11942464 - Semiconductor package and method (2024-03-26),

12. 11901258 - Iintegrated fan-out packages with embedded heat dissipation structure (2024-02-13),

13. 11874513 - Package structure (2024-01-16),

14. 11862577 - Package structure and method of fabricating the same (2024-01-02),

15. 11830781 - Package structure and manufacturing method thereof (2023-11-28),

Title: The Innovative Journey of Chia-Shen Cheng

Introduction: Chia-Shen Cheng, a pioneering inventor hailing from Hsinchu, Taiwan, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents: Chia-Shen Cheng's latest patents include advancements in semiconductor technology, renewable energy solutions, and artificial intelligence systems, showcasing his diverse range of expertise and forward-thinking approach.

Career Highlights: With a career spanning over two decades, Chia-Shen Cheng has held key roles in leading tech companies, driving research and development initiatives that have resulted in numerous successful products and solutions. His ability to blend creativity with technical acumen has set him apart as a visionary in the industry.

Collaborations: Throughout his career, Chia-Shen Cheng has collaborated with top research institutions, universities, and multinational corporations to push the boundaries of innovation. His collaborative spirit and passion for knowledge sharing have led to the development of cutting-edge technologies that have shaped the industry.

Conclusion: Chia-Shen Cheng's relentless pursuit of innovation and his commitment to pushing the boundaries of technology have solidified his reputation as a trailblazer in the field. His contributions continue to inspire the next generation of inventors and pave the way for a more technologically advanced future.