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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11874513 B1

PDFFull Text
Date of Patent:
Jan. 16, 2024

Filed:

Feb. 01, 2023

Package structure

Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Chia-Lun Chang, Tainan, TW;

Ching-Hua Hsieh, Hsinchu, TW;

Cheng-Ting Chen, Taichung, TW;

Hsiu-Jen Lin, Hsinchu County, TW;

Hsuan-Ting Kuo, Taichung, TW;

Chia-Shen Cheng, Hsinchu County, TW;

Chih-Chiang Tsao, Taoyuan, TW;

Assignee:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Attorney:

JCIPRNET

Primary Examiner:

Tina M Wong

Int. Cl.
CPC ...
G02B 6/42 (2006.01); H01L 23/538 (2006.01); H01L 25/18 (2023.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 25/00 (2006.01); H01L 21/683 (2006.01); H01L 21/56 (2006.01); G02B 6/43 (2006.01); H05K 1/18 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
G02B 6/428 (2013.01); G02B 6/4214 (2013.01); G02B 6/4253 (2013.01); G02B 6/43 (2013.01); H01L 21/561 (2013.01); H01L 21/565 (2013.01); H01L 21/6835 (2013.01); H01L 23/3128 (2013.01); H01L 23/5386 (2013.01); H01L 24/24 (2013.01); H01L 24/82 (2013.01); H01L 24/96 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01); H05K 1/0274 (2013.01); H05K 1/181 (2013.01); H01L 21/568 (2013.01); H01L 2221/68359 (2013.01); H01L 2221/68372 (2013.01); H01L 2221/68381 (2013.01); H01L 2224/215 (2013.01); H01L 2224/24225 (2013.01); H01L 2224/821 (2013.01); H01L 2224/82005 (2013.01); H01L 2224/95001 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/12043 (2013.01); H05K 2201/10121 (2013.01); H05K 2201/10151 (2013.01); H05K 2201/2054 (2013.01);
Abstract

In an embodiment, a package structure including an electro-optical circuit board, a fanout package disposed over the electro-optical circuit board is provided. The electro-optical circuit board includes an optical waveguide. The fanout package includes a first optical input/output portion, a second optical input/output portion and a plurality of electrical input/output terminals electrically connected to the electro-optical circuit board. The first optical input/output portion is optically coupled to the second optical input/output portion through the optical waveguide of the electro-optical circuit board.

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