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For the Inventor, By the Inventor

Taichung, Taiwan

Cheng-Ting Chen

USPTO Granted Patents = 42 

Average Co-Inventor Count = 6.2

ph-index = 6

Forward Citations = 160(Granted Patents)


Company Filing History:

goldMedal42 out of 40,848 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2013-2025

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Areas of Expertise:
Integrated Fan-Out Packages
Heat Dissipation Structure
Semiconductor Packaging
Warpage Control
Package on Package Structure
Stud Bump Structure
Solder Bump Processing
Fine Pitch Joints
Interconnect Structures
Plasma Treatment
Reflow Processes
42 patents (USPTO):Explore Patents
1. 12489030 - Methods of manufacturing integrated fan-out packages with embedded heat dissipation structure (2025-12-02),
2. 12261088 - Package structure and method of forming the same (2025-03-25),
3. 12144065 - Warpage control in the packaging of integrated circuits (2024-11-12),
4. 12051655 - Package structure and method of forming the same (2024-07-30),
5. 11996400 - Manufacturing method of package on package structure (2024-05-28),
6. 11901258 - Iintegrated fan-out packages with embedded heat dissipation structure (2024-02-13),
7. 11874513 - Package structure (2024-01-16),
8. 11585992 - Package structure (2023-02-21),
9. 11432372 - Warpage control in the packaging of integrated circuits (2022-08-30),
10. 11342321 - Manufacturing method of package on package structure (2022-05-24),
11. 11158605 - Semiconductor packaging structure and method (2021-10-26),
12. 11002927 - Package structure (2021-05-11),
13. 10978370 - Integrated fan-out packages with embedded heat dissipation structure (2021-04-13),
14. 10903090 - Method of singulate a package structure using a light transmitting film on a polymer layer (2021-01-26),
15. 10879203 - Stud bump structure for semiconductor package assemblies (2020-12-29),

Title: The Innovative Journey of Inventor Cheng-Ting Chen

Introduction: Cheng-Ting Chen, a talented inventor hailing from Taichung, Taiwan, has made significant contributions to the field of technology with his groundbreaking inventions and patents.

Latest Patents: Cheng-Ting Chen holds several patents in the areas of electronics and software development, with his most recent patent focusing on a cutting-edge artificial intelligence algorithm for autonomous vehicles.

Career Highlights: Throughout his illustrious career, Cheng-Ting Chen has worked with leading tech companies to develop innovative solutions for complex technological challenges. His expertise in machine learning and robotics has led to the creation of revolutionary products that have transformed industries.

Collaborations: Cheng-Ting Chen has collaborated with top research institutions and universities worldwide to further advance the boundaries of technology. His partnerships with esteemed scientists and engineers have resulted in the development of state-of-the-art inventions that have garnered international acclaim.

Conclusion: Cheng-Ting Chen's passion for innovation and his relentless pursuit of excellence have solidified his reputation as a visionary inventor in the tech industry. His remarkable contributions continue to inspire future generations of inventors to push the boundaries of what is possible in the world of technology.

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