The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 26, 2021
Filed:
May. 16, 2019
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Cheng-Ting Chen, Taichung, TW;
Ching-Hua Hsieh, Hsinchu, TW;
Hsiu-Jen Lin, Hsinchu County, TW;
Hao-Jan Pei, Hsinchu, TW;
Wei-Yu Chen, Taipei, TW;
Chia-Lun Chang, Tainan, TW;
Chia-Shen Cheng, Hsinchu County, TW;
Cheng-Shiuan Wong, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Abstract
A method of forming a package structure includes the following processes. A die is attached to a polymer layer. An encapsulant is formed over the polymer layer to encapsulate sidewalls of the die. A RDL structure is formed on the encapsulant and the die. A conductive terminal is electrically connected to the die through the RDL structure. A light transmitting film is formed on the polymer layer. An alignment process is performed, and the alignment process uses an optical equipment to see through the light transmitting film to capture the alignment information included in the polymer layer. A singulating process is performed to singulate the package structure according to the alignment information.