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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10879203 B1

PDFFull Text
Date of Patent:
Dec. 29, 2020

Filed:

Sep. 18, 2017

Stud bump structure for semiconductor package assemblies

Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Meng-Tse Chen, Pingtung County, TW;

Hsiu-Jen Lin, Hsinchu County, TW;

Chih-Wei Lin, Hsinchu County, TW;

Cheng-Ting Chen, Taichung, TW;

Ming-Da Cheng, Jhubei, TW;

Chung-Shi Liu, Hsinchu, TW;

Assignee:

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;

Attorney:

Haynes and Boone, LLP

Primary Examiner:

David A Zarneke

Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 25/10 (2006.01); H01L 21/48 (2006.01); H01L 23/367 (2006.01);
U.S. Cl.
CPC ...
H01L 24/14 (2013.01); H01L 21/4853 (2013.01); H01L 23/49816 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/73 (2013.01); H01L 25/105 (2013.01); H01L 23/3677 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 2224/1134 (2013.01); H01L 2224/131 (2013.01); H01L 2224/1308 (2013.01); H01L 2224/13076 (2013.01); H01L 2224/13124 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/14135 (2013.01); H01L 2224/14136 (2013.01); H01L 2224/14179 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/17135 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73104 (2013.01); H01L 2224/73204 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/00012 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/15331 (2013.01); H01L 2924/15787 (2013.01); H01L 2924/3512 (2013.01);
Abstract

A semiconductor package structure comprises a substrate, a die bonded to the substrate, and one or more stud bump structures connecting the die to the substrate, wherein each of the stud bump structures having a stud bump and a solder ball encapsulating the stud bump to enhance thermal dissipation and reduce high stress concentrations in the semiconductor package structure.

Find Patent Forward Citations

Chen, Meng-Tse. (2020). Stud bump structure for semiconductor package assemblies (U.S. Patent No. 10879203). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10879203

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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