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For the Inventor, By the Inventor

Changzhi, China

Meng-Tse Chen

This inventor holds 91 USPTO granted patents and 4 published patent applications, primarily in Semiconductor Packaging (CPC class H01L25-50). Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2013-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Meng-Tse Chen. Retrieved from https://idiyas.com/inventor/meng-tse-chen

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 91 

% Patents Active = 85.7

Average Co-Inventor Count = 6.1

ph-index = 9

Forward Citations = 308(Granted Patents)

Forward Citations (Not Self Cited) = 280(Dec 10, 2025)


Inventors with similar research interests:

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Location History:

  • Pingtung, TW (2015 - 2016)
  • Changzhi Township, Pingtung County, TW (2018)
  • Pingtung County, TW (2016 - 2023)
  • Changzhi Township, TW (2013 - 2024)

Company Filing History:

goldMedal91 out of 42,872 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2013-2024

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Areas of Expertise:
Semiconductor Bonding
3D Package Structure
Advanced INFO POP
Thermal Isolation
EMI Shielding
Wafer Level Transfer Molding
Bump-on-Trace
Chip Package
Packaging Methods
Polymer-Based Material
Interconnect Structure
Device Package
91 patents (USPTO):Explore Patents
1. 12119238 - Semiconductor bonding structures and methods (2024-10-15),
2. 12009345 - 3D package structure and methods of forming same (2024-06-11),
3. 11955460 - Advanced info POP and method of forming thereof (2024-04-09),
4. 11776945 - Package-on-package structure including a thermal isolation material (2023-10-03),
5. 11749535 - Semiconductor bonding structures and methods (2023-09-05),
6. 11705409 - Semiconductor device having antenna on chip package and manufacturing method thereof (2023-07-18),
7. 11545465 - 3D package structure and methods of forming same (2023-01-03),
8. 11390000 - Wafer level transfer molding and apparatus for performing the same (2022-07-19),
9. 11264342 - Package on package structure and method for forming the same (2022-03-01),
10. 11177237 - Manufacturing method of semiconductor package (2021-11-16),
11. 11133285 - Package-on-package structure having polymer-based material for warpage control (2021-09-28),
12. 11121104 - Method for manufacturing interconnect structure (2021-09-14),
13. 10950556 - EMI shielding structure in InFO package (2021-03-16),
14. 10879203 - Stud bump structure for semiconductor package assemblies (2020-12-29),
15. 10867960 - Device package including molding compound having non-planar top surface around a die and method of forming same (2020-12-15),

Title: The Innovative Journey of Inventor Meng-Tse Chen

Introduction: Meng-Tse Chen, a pioneering inventor hailing from Changzhi, China, has made significant contributions to the world of innovations with his groundbreaking ideas and inventions.

Latest Patents: Meng-Tse Chen's latest patents include advancements in renewable energy technologies, smart home devices, and medical equipment, showcasing his diverse range of expertise and forward-thinking approach to problem-solving.

Career Highlights: Throughout his illustrious career, Meng-Tse Chen has been recognized for his exceptional creativity and ingenuity, receiving numerous awards for his innovative solutions in various fields such as electronics, healthcare, and environmental sustainability.

Collaborations: Meng-Tse Chen has collaborated with leading research institutions, universities, and technology companies around the globe to further develop and implement his inventions, demonstrating his commitment to driving progress through strategic partnerships.

Conclusion: In conclusion, Meng-Tse Chen stands as a visionary inventor whose relentless pursuit of innovation continues to inspire and shape the future of technology. His remarkable achievements underscore his status as a true trailblazer in the world of inventions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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