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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11177237 B1

PDFFull Text
Date of Patent:
Nov. 16, 2021

Filed:

Dec. 16, 2019

Manufacturing method of semiconductor package

Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Meng-Tse Chen, Pingtung County, TW;

Ching-Hua Hsieh, Hsinchu, TW;

Chung-Shi Liu, Hsinchu, TW;

Chih-Wei Lin, Hsinchu County, TW;

Assignee:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Attorney:

JCIPRNET

Primary Examiner:

Nitin Parekh

Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/00 (2006.01); H01L 21/683 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 24/49 (2013.01); H01L 21/561 (2013.01); H01L 21/568 (2013.01); H01L 21/6835 (2013.01); H01L 24/02 (2013.01); H01L 24/17 (2013.01); H01L 21/566 (2013.01); H01L 21/6836 (2013.01); H01L 23/3128 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68331 (2013.01); H01L 2221/68345 (2013.01); H01L 2221/68359 (2013.01); H01L 2221/68372 (2013.01); H01L 2224/0231 (2013.01); H01L 2224/0237 (2013.01); H01L 2224/17104 (2013.01); H01L 2224/18 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01029 (2013.01);
Abstract

A manufacturing method for semiconductor packages is provided. Chips are provided on a carrier. Through interlayer vias are formed over the carrier to surround the chips. A molding compound is formed over the carrier to partially and laterally encapsulate the chip and the through interlayer vias. The molding compound comprises pits on a top surface thereof. A polymeric molding compound is formed on the molding compound to fill the pits of the molding compound.

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Chen, Meng-Tse. (2021). Manufacturing method of semiconductor package (U.S. Patent No. 11177237). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11177237

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