The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 09, 2024
Filed:
Oct. 05, 2020
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Yi-Da Tsai, Dongshi Township, TW;
Meng-Tse Chen, Changzhi Township, TW;
Sheng-Feng Weng, Taichung, TW;
Sheng-Hsiang Chiu, Tainan, TW;
Wei-Hung Lin, Xinfeng Township, TW;
Ming-Da Cheng, Taoyuan, TW;
Ching-Hua Hsieh, Hsinchu, TW;
Chung-Shi Liu, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
In accordance with some embodiments, a package-on-package (PoP) structure includes a first semiconductor package having a first side and a second side opposing the first side, a second semiconductor package having a first side and a second side opposing the first side, and a plurality of inter-package connector coupled between the first side of the first semiconductor package and the first side of the second semiconductor package. The PoP structure further includes a first molding material on the second side of the first semiconductor package. The second side of the second semiconductor package is substantially free of the first molding material.