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For the Inventor, By the Inventor

Taichung, Taiwan

Sheng-Feng Weng

This inventor holds 24 USPTO granted patents and 5 published patent applications, primarily in Semiconductor Packaging. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., National Yang Ming Chiao Tung University. Active years: 2015-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Sheng-Feng Weng. Retrieved from https://idiyas.com/inventor/sheng-feng-weng

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 24 

% Patents Active = 91.7

Average Co-Inventor Count = 7.0

ph-index = 2

Forward Citations = 47(Granted Patents)


Location History:

  • Hsinchu, TW (2017)
  • Taichung, TW (2015 - 2024)

Company Filing History:

goldMedal22 out of 42,872 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal2 out of 1,247 
 
National Yang Ming Chiao Tung University
 patents

Years Active: 2015-2026

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Areas of Expertise:
Semiconductor Package
Interconnect Structures
Memory Device
Three-Dimensional Integrated Circuits
Molded Device
Package-on-Package
Catalyst Production
Ethanol Reforming
24 patents (USPTO):Explore Patents
1. 12660656 - Packaged interconnect structures (2026-06-16),
2. 12593732 - Semiconductor device and manufacturing method thereof (2026-03-31),
3. 12568854 - Semiconductor packages having semiconductor blocks surrounding semiconductor device (2026-03-03),
4. 12512419 - Method of fabricating memory device and package structure (2025-12-30),
5. 12512384 - Semiconductor package with electrically conductive structure and manufacturing method thereof (2025-12-30),
6. 12358194 - Molded semiconductor device and manufacturing method of molded semiconductor device (2025-07-15),
7. 12354997 - Package structure and manufacturing method thereof (2025-07-08),
8. 12354929 - Package structure and manufacturing method thereof (2025-07-08),
9. 12334424 - Package structure and manufacturing method thereof (2025-06-17),
10. 12230549 - Three-dimensional integrated circuit structures and methods of forming the same (2025-02-18),
11. 12218082 - Package structure (2025-02-04),
12. 12011859 - Molding apparatus and manufacturing method of molded semiconductor device (2024-06-18),
13. 11955460 - Advanced info POP and method of forming thereof (2024-04-09),
14. 11855006 - Memory device, package structure and fabricating method thereof (2023-12-26),
15. 11731327 - Molding apparatus and manufacturing method of molded semiconductor device (2023-08-22),

Title: The Innovative Journey of Inventor Sheng-Feng Weng

Introduction: Sheng-Feng Weng, a talented inventor hailing from Taichung, Taiwan, has made significant contributions to the field of innovations with his creative mind and dedication to technological advancements.

Latest Patents: Sheng-Feng Weng holds several patents in various technological domains, showcasing his versatility and expertise in inventing cutting-edge solutions to real-world problems.

Career Highlights: Throughout his illustrious career, Sheng-Feng Weng has been recognized for his groundbreaking inventions that have revolutionized industries. His commitment to pushing the boundaries of innovation has led to the development of solutions that have improved efficiency and effectiveness in numerous sectors.

Collaborations: Sheng-Feng Weng has collaborated with leading research institutions, universities, and companies to bring his inventions to life. His ability to work in multidisciplinary teams has resulted in the successful implementation of his innovative ideas.

Conclusion: In conclusion, Sheng-Feng Weng's passion for innovation, coupled with his technical expertise, has established him as a prominent figure in the world of inventors. His relentless pursuit of excellence continues to inspire future generations of inventors to push the limits of what is possible.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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