Jen-Jui Yu

Title: Innovations by Inventor Jen-Jui Yu in Semiconductor Packaging

Introduction

Jen-Jui Yu, a prominent inventor based in Taipei, Taiwan, has made significant contributions to the field of semiconductor packaging. With a remarkable portfolio of ten patents, Yu's work focuses on innovative solutions that enhance the performance and reliability of semiconductor devices.

Latest Patents

Among his latest patents is a groundbreaking package structure and method of forming the same. This invention features a sophisticated package structure that includes a die with a semiconductor substrate, conductive pads, and a passivation layer, all encapsulated by an innovative encapsulation layer. Additionally, the design incorporates a redistribution layer structure comprising at least one embedded redistribution layer within a polymer layer, ensuring optimal contact with the semiconductor device's passivation layer.

Yu's patented semiconductor package and manufacturing method also stands out, highlighting a unique approach to creating a semiconductor package that features a substrate and a semiconductor device. What distinguishes this invention is the integration of a plurality of solder joint structures, each containing 2% to 23% Indium (In) by weight, enhancing the reliability and efficiency of the connections between the semiconductor device and the substrate.

Career Highlights

Jen-Jui Yu currently works at Taiwan Semiconductor Manufacturing Company Limited, a leading player in the global semiconductor industry. His contributions to the field have been recognized not only due to the volume of patents he holds but also for the innovative methodologies that have emerged from his research and development efforts.

Collaborations

Yu collaborates closely with esteemed colleagues, including Hsiu-Jen Lin and Ching-Hua Hsieh, who contribute diverse expertise that complements his inventions. Together, they foster a collaborative environment conducive to pioneering advancements in semiconductor technology.

Conclusion

Through his inventive spirit and collaborative efforts, Jen-Jui Yu continues to lead in the realm of semiconductor packaging innovations. His patents reflect a deep understanding of materials and processes, showcasing his commitment to developing efficient and effective semiconductor solutions that contribute to the future of electronic technology.