Taiwan Semiconductor Manufacturing Comp. Ltd.

Jen-Jui Yu

Ching-Hua Hsieh

Hsiu-Jen Lin

Chih-Chiang Tsao

Wei-Yu Chen

Hao-Jan Pei

Hsuan-Ting Kuo

Chia-Lun Chang

Chia-Shen Cheng

Chih-Hua Chen

Yu-Chih Huang

Cheng-Ting Chen

Yu-Peng Tsai

Philip Yu-Shuan Chung

Cheng-Shiuan Wong

Chao-Wei Chiu

Mao-Yen Chang

A method includes forming regions of solder paste on a redistribution structure, wherein the solder paste has a first melting temperature; forming solder bumps on an interconnect structure, wherein the solder bumps have a second melting temperature that is greater than the first melting temperature; placing the solder bumps on the regions of solder paste; performing a first reflow process at a first reflow temperature for a first duration of time, wherein the first reflow temperature is less than the second melting temperature; and after performing the first reflow process, performing a second reflow process at a second reflow temperature for a second duration of time, wherein the second reflow temperature is greater than the second melting temperature.

Semiconductor device and method of manufacture

A package structure includes a die, an encapsulation layer, a redistribution layer structure and an adhesive material. The die includes a semiconductor substrate, conductive pads disposed over the semiconductor substrate and a passivation layer disposed over the semiconductor substrate and around the conductive pads. The encapsulation layer laterally encapsulates the die. the redistribution layer structure is disposed on the die and the encapsulation layer, and includes at least one redistribution layer embedded in at least one polymer layer, and the polymer layer contacts a portion of the passivation layer. The adhesive material is disposed on the die and covers an interface between the polymer layer and the passivation layer.

Package structure and method of forming the same

A semiconductor package includes a substrate, a semiconductor device over the substrate and a plurality of solder joint structures bonded between the semiconductor device and the substrate, wherein each of the plurality of solder joint structures includes, by weight percent, 2% to 23% of Indium (In).

Semiconductor package and manufacturing method thereof

A package structure includes a first package, a second package, a conductive spacer, and a flux portion. The first package includes a semiconductor die. The second package is stacked to the first package. The conductive spacer is disposed between and electrically couples the first package and the second package. The flux portion is disposed between and electrically couples the first package and the conductive spacer, where the flux portion includes a first portion and a second portion separating from the first portion by a gap, and the first portion and the second portion are symmetric about an extending direction of the gap. The gap is overlapped with the conductive spacer.

Package structure and manufacturing method thereof

A package structure and a method of forming the same are provided. The package structure includes a die, an encapsulant, a redistribution layer (RDL) structure, a passive device, and a plurality of dummy items. The encapsulant laterally encapsulates the die. The RDL structure is disposed on the die and the encapsulant. The passive device is disposed on and electrically bonded to the RDL structure. The plurality of dummy items are disposed on the RDL structure and laterally aside the passive device, wherein top surfaces of the plurality of dummy items are higher than a top surface of the passive device.

Provided is a package structure, including a die, a plurality of through vias, an encapsulant, a plurality of first connectors, a warpage control material and a protection material. The plurality of through vias are disposed around the die. The encapsulant laterally encapsulate the die and the plurality of through vias. The plurality of first connectors are electrically connected to a first surface of the plurality of through vias. The warpage control material is disposed over a first surface of the die. The protection material is disposed over the encapsulant, around the plurality of first connectors and the warpage control material. A Young's modulus of the warpage control material is greater than a Young's modulus of the encapsulant, and the Young's modulus of the encapsulant is greater than a Young's modulus of the protection material.

Package structure and method of fabricating the same

A package structure includes an insulating encapsulation, at least one die, and conductive structures. The at least one die is encapsulated in the insulating encapsulation. The conductive structures are located aside of the at least one die and surrounded by the insulating encapsulation, and at least one of the conductive structures is electrically connected to the at least one die. Each of the conductive structures has a first surface, a second surface opposite to the first surface and a slant sidewall connecting the first surface and the second surface, and each of the conductive structures has a top diameter greater than a bottom diameter thereof, and wherein each of the conductive structures has a plurality of pores distributed therein.

Package structure with porous conductive structure and manufacturing method thereof

Provided is a package structure, including a die, a plurality of through vias, an encapsulant, a plurality of first connectors, a warpage control material and a protection material. The plurality of through vias are disposed around the die. The encapsulant laterally encapsulate the die and the plurality of through vias. The plurality of first connectors are electrically connected to the plurality of through vias. The warpage control material is disposed over a first surface of the die. The protection material is disposed over the encapsulant, around the plurality of first connectors and the warpage control material.

Package structure and method of fabrcating the same

In an embodiment, a device includes: an integrated circuit die; an encapsulant at least partially encapsulating the integrated circuit die; a redistribution structure on the encapsulant, the redistribution structure being electrically connect to the integrated circuit die, the redistribution structure including a pad; a passive device including a conductive connector physically and electrically connected to the pad; and a protective structure disposed between the passive device and the redistribution structure, the protective structure surrounding the conductive connector, the protective structure including an epoxy flux, the protective structure having a void disposed therein.

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Taipei, Taiwan

Jen-Jui Yu