The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 14, 2021
Filed:
Jul. 01, 2019
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Jen-Jui Yu, Taipei, TW;
Hao-Jan Pei, Hsinchu, TW;
Wei-Yu Chen, Taipei, TW;
Chia-Lun Chang, Tainan, TW;
Hsiu-Jen Lin, Zhubei, TW;
Ching-Hua Hsieh, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Abstract
In an embodiment, a device includes: an integrated circuit die; an encapsulant at least partially encapsulating the integrated circuit die; a redistribution structure on the encapsulant, the redistribution structure being electrically connect to the integrated circuit die, the redistribution structure including a pad; a passive device including a conductive connector physically and electrically connected to the pad; and a protective structure disposed between the passive device and the redistribution structure, the protective structure surrounding the conductive connector, the protective structure including an epoxy flux, the protective structure having a void disposed therein.