Yu-Peng Tsai

This inventor holds 38 USPTO granted patents and 6 published patent applications, primarily in Semiconductor Packaging. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2013-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yu-Peng Tsai. Retrieved from https://idiyas.com/inventor/yu-peng-tsai

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 38 (Patent Applications = 6)

% Patents Active = 89.5

Average Co-Inventor Count = 7.1

ph-index = 6

Forward Citations = 181(Granted Patents)

Location History:

Taipei, TW (2013 - 2024)
Hsin-Chu, TW (2017 - 2024)

Company Filing History:

38 out of 42,810

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

Years Active: 2013-2026

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Areas of Expertise:

Laser Reflow

Package-On-Package

Semiconductor Device

3DIC Package

Porous Conductive Structure

Solder Bump Processing

Wafer Separation

Molding Compound

Thermal Management

Device Packaging

Dicing Methods

Manufacturing Techniques

38 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12581977 - Bonding through multi-shot laser reflow (2026-03-17),

2. 12040309 - Bonding through multi-shot laser reflow (2024-07-16),

3. 11996400 - Manufacturing method of package on package structure (2024-05-28),

4. 11830781 - Package structure and manufacturing method thereof (2023-11-28),

5. 11532498 - Package-on-package structure (2022-12-20),

6. 11482491 - Package structure with porous conductive structure and manufacturing method thereof (2022-10-25),

7. 11462507 - Bonding through multi-shot laser reflow (2022-10-04),

8. 11342321 - Manufacturing method of package on package structure (2022-05-24),

9. 11239103 - Package-on-package structure (2022-02-01),

10. 10868353 - Electronic device and manufacturing method thereof (2020-12-15),

11. 10790261 - Bonding through multi-shot laser reflow (2020-09-29),

12. 10784221 - Method of processing solder bump by vacuum annealing (2020-09-22),

13. 10622240 - Package on-package structure (2020-04-14),

14. 10535644 - Manufacturing method of package on package structure (2020-01-14),

15. 10134703 - Package on-package process for applying molding compound (2018-11-20),

Title: The Innovative Journey of Inventor Yu-Peng Tsai

Introduction: Yu-Peng Tsai is a pioneering inventor hailing from Taipei, Taiwan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Yu-Peng Tsai holds several patents in the areas of electronics, software development, and renewable energy technologies, showcasing his diverse range of expertise and innovative spirit.

Career Highlights: With a career spanning over two decades, Tsai has worked with leading tech companies and research institutions, spearheading projects that have revolutionized the industry. His commitment to pushing the boundaries of what is possible has earned him recognition as a visionary in the field.

Collaborations: Throughout his career, Yu-Peng Tsai has collaborated with top engineers, scientists, and researchers from around the globe, fostering a culture of innovation and knowledge-sharing. His collaborative efforts have led to the development of cutting-edge technologies that have had a lasting impact on society.

Conclusion: Yu-Peng Tsai's relentless pursuit of innovation and his passion for creating solutions to complex challenges have solidified his reputation as a trailblazer in the world of inventions. His work continues to inspire future generations of inventors and innovators to push the boundaries of what is possible.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

6 patents pending: