The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 15, 2020
Filed:
Apr. 18, 2019
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Chun-Lin Lu, Hsinchu, TW;
Hsiu-Jen Lin, Hsinchu County, TW;
Hsuan-Ting Kuo, Taichung, TW;
Kai-Chiang Wu, Hsinchu, TW;
Ming-Che Ho, Tainan, TW;
Wei-Yu Chen, Taipei, TW;
Yu-Peng Tsai, Hsinchu, TW;
Chia-Lun Chang, Tainan, TW;
Chia-Shen Cheng, Hsinchu County, TW;
Chih-Chiang Tsao, Taoyuan, TW;
Tzu-Chun Tang, Kaohsiung, TW;
Ching-Hua Hsieh, Hsinchu, TW;
Tuan-Yu Hung, Changhua County, TW;
Cheng-Shiuan Wong, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Abstract
An electronic device and a manufacturing method thereof are provided. The electronic device includes a chip package, an antenna pattern, and an insulating layer. The chip package includes a semiconductor die and an insulating encapsulation enclosing the semiconductor die. The antenna pattern is electrically coupled to the chip package, where a material of the antenna pattern comprises a conductive powder having fused metal particles. The insulating layer disposed between the chip package and the antenna pattern, where the antenna pattern includes a first surface in contact with the insulating layer, and a second surface opposite to the first surface, and a surface roughness of the second surface is greater than a surface roughness of the first surface.