Tainan, Taiwan

Ming-Che Ho

USPTO Granted Patents = 99 

Average Co-Inventor Count = 4.2

ph-index = 8

Forward Citations = 252(Granted Patents)

Forward Citations (Not Self Cited) = 240(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Hsin-Chu, TW (2015 - 2022)
  • Tainan, TW (2012 - 2024)

Company Filing History:


Years Active: 2012-2025

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Areas of Expertise:
Semiconductor Packages
Integrated Circuit Package
Manufacturing Methods
Composite Seed-Barrier Layer
Integrated Fan-Out Package
Redistribution Structure
Bonding Structures
Thermal Paths
Plating Apparatus
Electronic Devices
Semiconductor Devices
Packaging Techniques
99 patents (USPTO):Explore Patents

Title: Ming-Che Ho: Pioneering Innovator in Semiconductor Technology

Introduction:

Ming-Che Ho, a distinguished inventor based in Tainan, Taiwan, is renowned for his exceptional passion for innovation and profound technical expertise. With a remarkable portfolio of 88 patents, Ho continues to leave a lasting impact on the world of inventors and inspire future generations of innovators globally.

Latest Patents:

Among his latest patents, Ho's groundbreaking inventions include a Semiconductor Package and Method. This device features an integrated circuit die, a through via, a molding compound, and a redistribution structure, showcasing his advanced technical skills in semiconductor technology. Additionally, his Integrated Circuit Package and Method patent highlights his innovative approach to encapsulating integrated circuit dies with fillers and through vias, further solidifying his reputation as a leading inventor in the field.

Career Highlights:

Ho is a valued member of Taiwan Semiconductor Manufacturing Company Limited (TSMC), where he channels his creativity and expertise to push the boundaries of semiconductor technology. His contributions to TSMC have played a pivotal role in shaping the company's success and reputation as a key player in the industry.

Collaborations:

Throughout his career, Ho has collaborated with esteemed colleagues such as Hung-Jui Kuo and Chung-Shi Liu, demonstrating his ability to work effectively in team settings and leverage collective expertise to drive innovation. Together, they have spearheaded cutting-edge projects and achieved significant milestones in semiconductor research and development.

Conclusion:

In conclusion, Ming-Che Ho's relentless dedication to innovation, coupled with his profound technical acumen, has solidified his status as a pioneering inventor in semiconductor technology. His impressive patent portfolio, career achievements at TSMC, and successful collaborations underscore his invaluable contributions to the world of inventors and inspire a new wave of innovation in the industry.

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