The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 20, 2018
Filed:
Sep. 23, 2014
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Meng-Tse Chen, Changzhi Township, TW;
Wei-Hung Lin, Xinfeng Township, TW;
Sheng-Yu Wu, Hsin-Chu, TW;
Bor-Ping Jang, Chu-Bei, TW;
Ming-Da Cheng, Jhubei, TW;
Chung-Shi Liu, Hsin-Chu, TW;
Hsiu-Jen Lin, Zhubei, TW;
Wen-Hsiung Lu, Jhonghe, TW;
Chih-Wei Lin, Zhubei, TW;
Yu-Peng Tsai, Taipei, TW;
Kuei-Wei Huang, Hsin-Chu, TW;
Chun-Cheng Lin, New Taipei, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
A method of packaging includes placing a package component over a release film, wherein solder regions on a surface of the package component are in physical contact with the release film. Next, A molding compound filled between the release film and the package component is cured, wherein during the step of curing, the solder regions remain in physical contact with the release film.