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Bor-Ping Jang

This inventor holds 41 USPTO granted patents and 3 published patent applications, primarily in Semiconductor Packaging. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 1998-2023.

USPTO Granted Patents = 41 (Patent Applications = 3)

% Patents Active = 75.6

Average Co-Inventor Count = 5.1

ph-index = 5

Forward Citations = 117(Granted Patents)

Location History:

Ping Tung, TW (1998 - 2006)
Hsinchu, TW (2015)
Hsin-Chu County, TW (2016 - 2021)
Chu-Bei, TW (2013 - 2023)

Company Filing History:

41 out of 42,759

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

Years Active: 1998-2023

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Areas of Expertise:

Wafer Thinning

Bonding Structures

Semiconductor Packaging

Warpage Control

Wafer-Level Molding

Thermal Compress Bonding

Interconnect Structure

Package on Package

Underfill

Molding Compound

Dipping Plate

Photoresist Planarity

41 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11721555 - Method and system for thinning wafer thereof (2023-08-08),

2. 11390000 - Wafer level transfer molding and apparatus for performing the same (2022-07-19),

3. 11233032 - Mechanisms for forming bonding structures (2022-01-25),

4. 11139177 - Method of fabricating semiconductor package structure (2021-10-05),

5. 11094561 - Semiconductor package structure (2021-08-17),

6. 11024618 - Wafer-level underfill and over-molding (2021-06-01),

7. 10985135 - Methods for controlling warpage in packaging (2021-04-20),

8. 10804234 - Semiconductor device having a boundary structure, a package on package structure, and a method of making (2020-10-13),

9. 10770331 - Semiconductor wafer device and manufacturing method thereof (2020-09-08),

10. 10727074 - Method and system for thinning wafer thereof (2020-07-28),

11. 10679866 - Interconnect structure for semiconductor package and method of fabricating the interconnect structure (2020-06-09),

12. 10513070 - Wafer level transfer molding and apparatus for performing the same (2019-12-24),

13. 10510712 - Methods for controlling warpage in packaging (2019-12-17),

14. 10504870 - Mechanisms for forming bonding structures (2019-12-10),

15. 10276531 - Semiconductor device having a boundary structure, a package on package structure, and a method of making (2019-04-30),

Title: The Innovative Journey of Bor-Ping Jang

Introduction:

Bor-Ping Jang, a pioneering inventor hailing from Chu-Bei, Taiwan, has made significant contributions to the world of innovations with his groundbreaking ideas and inventions.

Latest Patents:

Bor-Ping Jang holds several patents in various fields, including technology, healthcare, and environmental sustainability. His recent patents focus on renewable energy solutions and smart home technologies, showcasing his versatility and forward-thinking approach.

Career Highlights:

Throughout his illustrious career, Bor-Ping Jang has been at the forefront of technological advancements. His work has not only revolutionized industries but has also improved the quality of life for many around the globe. From inventing cutting-edge medical devices to developing eco-friendly solutions, his impact is truly remarkable.

Collaborations:

Bor-Ping Jang has collaborated with leading research institutions, universities, and companies to bring his inventions to life. His ability to work across disciplines and sectors has led to the creation of innovative products that have set new standards in the industry.

Conclusion:

In conclusion, Bor-Ping Jang's dedication to innovation and his relentless pursuit of excellence have established him as a visionary inventor. His passion for creating solutions to complex challenges continues to inspire the next generation of inventors and innovators worldwide.

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