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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10727074 B1

PDFFull Text
Date of Patent:
Jul. 28, 2020

Filed:

Sep. 01, 2015

Method and system for thinning wafer thereof

Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;

Inventors:

Chien Ling Hwang, Hsinchu, TW;

Bor-Ping Jang, Chu-Bei, TW;

Hsin-Hung Liao, Taipei, TW;

Chung-Shi Liu, Hsinchu, TW;

Assignee:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

Dah-Wei D Yuan

Assistant Examiner:

Stephen A Kitt

Int. Cl.
CPC ...
H01L 21/308 (2006.01); H01L 21/306 (2006.01); H01L 21/68 (2006.01); H01L 21/67 (2006.01); H01L 21/78 (2006.01); H01L 21/683 (2006.01); C23C 16/458 (2006.01); B05C 21/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/3083 (2013.01); H01L 21/3081 (2013.01); H01L 21/30604 (2013.01); H01L 21/6708 (2013.01); H01L 21/682 (2013.01); H01L 21/6835 (2013.01); H01L 21/78 (2013.01); B05C 21/005 (2013.01); C23C 16/4585 (2013.01); H01L 21/6836 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68327 (2013.01);
Abstract

A method for thinning a wafer is provided. The method includes placing a wafer on a support assembly and securing an etching mask to a backside of the wafer. The etching mask covers a peripheral portion of the wafer. The method further includes performing a wet etching process on the backside of the wafer to form a thinned wafer, and the thinned wafer includes peripheral portions having a first thickness and a central portion having a second thickness smaller than the first thickness. A system for forming the thinned wafer is also provided.

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