This inventor holds 33 USPTO granted patents and 3 published patent applications, primarily in Semiconductor Packaging. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., National Taiwan University. Active years: 2012-2023.
Location History:
- Hsin-Chu, TW (2013 - 2017)
- Taipei, TW (2012 - 2023)
Company Filing History:
31 out of 42,759Â 
2 out of 1,391Â 
Years Active: 2012-2023
Areas of Expertise:
Title: Innovations and Contributions of Hsin-Hung Liao in Semiconductor Technology
Introduction: Hsin-Hung Liao, a prominent inventor based in Taipei, Taiwan, has made significant contributions to the field of semiconductor technology. With 33 patents to his name, Liao has focused on enhancing methods and systems in semiconductor manufacturing, showcasing his expertise and innovation in the industry.
Latest Patents: Among Liao's latest patents are two notable inventions. The first is a "Method and System for Thinning Wafer Thereof," which outlines a process for effectively thinning a wafer. This method includes the use of an etching mask secured to the wafer's backside, allowing for a controlled wet etching process that results in a thinned wafer with varying thickness across its peripheral and central portions. The second invention, "Semiconductor Package with Chamfered Semiconductor Device," involves a semiconductor package design that features a chamfer on one side of the semiconductor device. This package not only encapsulates the device with a protective material but also incorporates a redistribution structure that enhances its electrical connections.
Career Highlights: Hsin-Hung Liao has played key roles in several reputable organizations throughout his career. He has been associated with Taiwan Semiconductor Manufacturing Company (TSMC) and National Taiwan University, where he has further developed his expertise and contributed to groundbreaking innovations in semiconductor research and development.
Collaborations: Throughout his career, Liao has collaborated with prominent professionals in the field, including Chung-Shi Liu and Bor-Ping Jang. These collaborations have enriched his research and led to successful innovations that have impacted the semiconductor industry.
Conclusion: Hsin-Hung Liao's dedication to advancing semiconductor technology through innovative patents has positioned him as a respected figure in the field. His work continues to influence the development of more efficient semiconductor devices and manufacturing processes, reflecting the importance of innovation in technology.