The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 24, 2021
Filed:
Oct. 29, 2018
Applicant:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Inventors:
Ying-Jui Huang, Hsinchu County, TW;
Chung-Shi Liu, Hsinchu, TW;
Hsin-Hung Liao, Taipei, TW;
Chien-Ling Hwang, Hsinchu, TW;
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); C25D 1/00 (2006.01); C25D 1/22 (2006.01);
U.S. Cl.
CPC ...
H01L 24/11 (2013.01); C25D 1/00 (2013.01); C25D 1/22 (2013.01); H01L 24/13 (2013.01); H01L 24/64 (2013.01); H01L 24/66 (2013.01); H01L 2224/11001 (2013.01); H01L 2224/1111 (2013.01); H01L 2224/11462 (2013.01); H01L 2224/11622 (2013.01); H01L 2224/13013 (2013.01); H01L 2224/13017 (2013.01); H01L 2924/2064 (2013.01);
Abstract
A conductive micro pin includes a body having a first end surface, a second end surface, a first side surface connecting the first end surface and the second end surface, and a first corner between the first end surface and the first side surface, in which the first side surface is substantially flat, and the first corner is substantially rounded.