The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 15, 2020
Filed:
Mar. 05, 2019
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Chien-Ling Hwang, Hsinchu, TW;
Ching-Hua Hsieh, Hsinchu, TW;
Hsin-Hung Liao, Taipei, TW;
Sung-Yueh Wu, Chiayi County, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Abstract
A semiconductor device and a manufacturing method thereof are provided. The semiconductor device includes a first semiconductor die, at least one first conductive connector disposed beside the first semiconductor die and electrically coupled to the first semiconductor die, an insulating encapsulation laterally encapsulating the first semiconductor die and the at least one first conductive connector, and a redistribution structure disposed on the insulating encapsulation and being in contact with the first semiconductor die and the at least one first conductive connector. A thickness of the at least one first conductive connector is less than a thickness of the insulating encapsulation.