The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 10, 2019
Filed:
Sep. 18, 2017
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Inventors:
Yeong-Jyh Lin, Caotun Township, TW;
Hsin-Hung Liao, Taipei, TW;
Chien Ling Hwang, Hsinchu, TW;
Bor-Ping Jang, Chu-Bei, TW;
Hsiao-Chung Liang, Hsinchu, TW;
Chung-Shi Liu, Hsinchu, TW;
Assignee:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 25/03 (2006.01); H01L 25/065 (2006.01); H01L 25/10 (2006.01); H01L 25/00 (2006.01); H01L 23/498 (2006.01); H01L 25/11 (2006.01);
U.S. Cl.
CPC ...
H01L 24/81 (2013.01); H01L 21/4853 (2013.01); H01L 23/49811 (2013.01); H01L 25/03 (2013.01); H01L 25/0657 (2013.01); H01L 25/105 (2013.01); H01L 25/117 (2013.01); H01L 25/50 (2013.01); H01L 24/16 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48225 (2013.01); H01L 2224/73265 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/181 (2013.01);
Abstract
Embodiments of mechanisms for forming a package are provided. The package includes a substrate and a contact pad formed on the substrate. The package also includes a conductive pillar bonded to the contact pad through solder formed between the conductive pillar and the contact pad. The solder is in direct contact with the conductive pillar.