Location History:
- Taichung, TW (2017)
- Hsin-Chu, TW (2015 - 2023)
Company Filing History:
Years Active: 2015-2025
Title: Innovations by Hsiao-Chung Liang: Pioneering Semiconductor Package Structures
Introduction: Hsiao-Chung Liang is an accomplished inventor based in Hsinchu, Taiwan, recognized for his contributions to the field of semiconductor technology. With a total of 13 patents to his name, Liang has established himself as a leading figure in innovative package structures that enhance the reliability and performance of semiconductor devices.
Latest Patents: Among Liang's latest innovations is a novel package structure designed to improve the integration of semiconductor packages. This innovative design incorporates a bottom plate, a semiconductor package, a top plate, a screw, and an anti-loosening coating. The unique architecture allows the semiconductor package to be securely housed above the bottom plate, while the top plate, featuring an internal thread in a screw hole, enhances stability. The screw, which penetrates through the various layers, has an external thread that engages with the internal thread of the top plate. The anti-loosening coating plays a crucial role by adhering between the external and internal threads, ensuring a robust connection.
Career Highlights: Hsiao-Chung Liang has made significant contributions while working at Taiwan Semiconductor Manufacturing Company Limited (TSMC), one of the world's largest semiconductor manufacturers. His expertise in semiconductor packaging has led to advancements that benefit various applications in the technology sector.
Collaborations: Throughout his career, Liang has collaborated with esteemed colleagues such as Bor-Ping Jang and Yeong-Jyh Lin, who have played pivotal roles in the development of new technologies alongside him. These partnerships have fostered an environment of innovation and creativity, resulting in multiple patents that reflect their collective expertise.
Conclusion: Hsiao-Chung Liang's work exemplifies the spirit of innovation in the semiconductor industry. His latest patent developments in package structures demonstrate a commitment to enhancing the durability and efficiency of semiconductor devices. As an inventor with a wealth of experience and numerous patents, Liang continues to play a vital role in shaping the future of semiconductor technology.