The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 30, 2019
Filed:
May. 16, 2017
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Chien Ling Hwang, Hsinchu, TW;
Yeong-Jyh Lin, Caotun Township, TW;
Bor-Ping Jang, Chu-Bei, TW;
Hsiao-Chung Liang, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Abstract
The present disclosure relates to a semiconductor device. In some embodiments, the semiconductor device has a first plurality of conductive pads arranged over a first substrate. A conductive solder material is arranged over and is electrically connected to the first plurality of conductive pads. A first boundary structure separates each conductive pad of the first plurality of conductive pads from an adjacent conductive pad of the first plurality of conductive pads. A die is arranged over the first substrate. The die has outermost sidewalls that are laterally separated from first and second ones of the first plurality of conductive pads by the first boundary structure.