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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9768142 B1

PDFFull Text
Expired
Date of Patent:
Sep. 19, 2017

Filed:

Jul. 17, 2013

Mechanisms for forming bonding structures

Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;

Inventors:

Yeong-Jyh Lin, Caotun Township, TW;

Hsin-Hung Liao, Hsinchu, TW;

Chien Ling Hwang, Hsinchu, TW;

Bor-Ping Jang, Chu-Bei, TW;

Hsiao-Chung Liang, Taichung, TW;

Chung-Shi Liu, Hsinchu, TW;

Assignee:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;

Attorney:

Slater Matsil, LLP

Primary Examiner:

Thao X Le

Assistant Examiner:

Xia Cross

Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 25/03 (2006.01); H01L 25/10 (2006.01); H01L 25/00 (2006.01); H01L 23/498 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 24/81 (2013.01); H01L 21/4853 (2013.01); H01L 23/49811 (2013.01); H01L 25/03 (2013.01); H01L 25/105 (2013.01); H01L 25/50 (2013.01); H01L 24/16 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 25/0657 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48225 (2013.01); H01L 2224/73265 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/181 (2013.01);
Abstract

Embodiments of mechanisms for forming a package are provided. The package includes a substrate and a contact pad formed on the substrate. The package also includes a conductive pillar bonded to the contact pad through solder formed between the conductive pillar and the contact pad. The solder is in direct contact with the conductive pillar.

Find Patent Forward Citations

Lin, Yeong-Jyh. (2017). Mechanisms for forming bonding structures (U.S. Patent No. 9768142). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9768142

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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