Taiwan Semiconductor Manufacturing Comp. Ltd.

Hsiao-Chung Liang

Yeong-Jyh Lin

Bor-Ping Jang

Chung-Shi Liu

Chien Ling Hwang

Hsin-Hung Liao

Chien-Ling Hwang

Chen-Hua Douglas Yu

Hao-Yi Tsai

Tin-Hao Kuo

Yu-Chia Lai

Chih-Hsuan Tai

Pei-Hsuan Lee

Kuo-Lung Pan

Jen-Chun Liao

Chih-Wei Lin

Ching-Hua Hsieh

Ying-Jui Huang

A pickup apparatus for separating a semiconductor package from an adhesive film includes a platform, a roller, a moving mechanism, and a collector element. The platform has a surface disposed with the adhesive film, where the adhesive film is disposed between the platform and the semiconductor package. The roller is disposed inside the platform and under the adhesive film, where the roller includes a body and a plurality of protrusions distributed over the body. The moving mechanism is connected to the roller to control a movement of the roller. The collector element is disposed over the platform and the adhesive film, where the collector element is configured to remove the semiconductor package from the adhesive film.

Pickup apparatus and method of using the same

A package structure includes a bottom plate, a semiconductor package, a top plate, a screw and an anti-loosening coating. The semiconductor package is disposed over the bottom plate. The top plate is disposed over the semiconductor package, and includes an internal thread in a screw hole of the top plate. The screw penetrates through the bottom plate, the semiconductor package and the top plate, and includes an external thread. The external thread of the screw is engaged to the internal thread of the top plate, and the anti-loosening coating is adhered between the external thread and the internal thread.

Package structure

Embodiments of mechanisms for forming a package are provided. The package includes a substrate and a contact pad formed on the substrate. The package also includes a conductive pillar bonded to the contact pad through solder formed between the conductive pillar and the contact pad. The solder is in direct contact with the conductive pillar.

Mechanisms for forming bonding structures

A method includes placing a plurality of dummy dies over a carrier, placing a plurality of device dies over the carrier, molding the plurality of dummy dies and the plurality of device dies in a molding compound, forming redistribution line over and electrically coupled to the device dies, and performing a die-saw to separate the device dies and the molding compound into a plurality of packages.

Methods for controlling warpage in packaging

The present disclosure, in some embodiments, relates to a semiconductor structure. The semiconductor structure includes a substrate and a first conductive pad arranged over the substrate. A boundary structure is on an upper surface of the substrate around the first conductive pad. The boundary structure has one or more sidewalls defining an opening with a round shape over the first conductive pad.

Semiconductor device having a boundary structure, a package on package structure, and a method of making

The present disclosure relates to a semiconductor device. In some embodiments, the semiconductor device has a first plurality of conductive pads arranged over a first substrate. A conductive solder material is arranged over and is electrically connected to the first plurality of conductive pads. A first boundary structure separates each conductive pad of the first plurality of conductive pads from an adjacent conductive pad of the first plurality of conductive pads. A die is arranged over the first substrate. The die has outermost sidewalls that are laterally separated from first and second ones of the first plurality of conductive pads by the first boundary structure.

A semiconductor device includes a substrate and a first conductive pad on a top surface of the substrate. The semiconductor device further includes a boundary structure on the top surface of the substrate around the conductive pad.

Growing community of inventors

Hsinchu, Taiwan

Hsiao-Chung Liang