The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 04, 2025
Filed:
Mar. 08, 2023
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Jen-Chun Liao, Taipei, TW;
Ching-Hua Hsieh, Hsinchu, TW;
Chih-Wei Lin, Hsinchu County, TW;
Hsiao-Chung Liang, Hsinchu, TW;
Ying-Jui Huang, Hsinchu County, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Abstract
A pickup apparatus for separating a semiconductor package from an adhesive film includes a platform, a roller, a moving mechanism, and a collector element. The platform has a surface disposed with the adhesive film, where the adhesive film is disposed between the platform and the semiconductor package. The roller is disposed inside the platform and under the adhesive film, where the roller includes a body and a plurality of protrusions distributed over the body. The moving mechanism is connected to the roller to control a movement of the roller. The collector element is disposed over the platform and the adhesive film, where the collector element is configured to remove the semiconductor package from the adhesive film.