The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 17, 2019
Filed:
Dec. 17, 2018
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Inventors:
Chien Ling Hwang, Hsinchu, TW;
Bor-Ping Jang, Chu-Bei, TW;
Hsin-Hung Liao, Taipei, TW;
Yeong-Jyh Lin, Caotun Township, TW;
Hsiao-Chung Liang, Hsinchu, TW;
Chung-Shi Liu, Hsinchu, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/538 (2006.01); H01L 21/78 (2006.01); H01L 21/56 (2006.01); H01L 23/16 (2006.01); H01L 21/683 (2006.01); H01L 21/3105 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 24/96 (2013.01); H01L 21/31051 (2013.01); H01L 21/561 (2013.01); H01L 21/565 (2013.01); H01L 21/568 (2013.01); H01L 21/6835 (2013.01); H01L 21/6836 (2013.01); H01L 21/78 (2013.01); H01L 23/16 (2013.01); H01L 23/5389 (2013.01); H01L 23/562 (2013.01); H01L 24/03 (2013.01); H01L 24/11 (2013.01); H01L 24/14 (2013.01); H01L 24/19 (2013.01); H01L 24/94 (2013.01); H01L 24/97 (2013.01); H01L 23/3128 (2013.01); H01L 2221/68327 (2013.01); H01L 2224/0231 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/1146 (2013.01); H01L 2224/11849 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/131 (2013.01); H01L 2224/49171 (2013.01); H01L 2224/96 (2013.01); H01L 2924/181 (2013.01); H01L 2924/18162 (2013.01); H01L 2924/3511 (2013.01);
Abstract
A method includes placing a plurality of dummy dies over a carrier, placing a plurality of device dies over the carrier, molding the plurality of dummy dies and the plurality of device dies in a molding compound, forming redistribution line over and electrically coupled to the device dies, and performing a die-saw to separate the device dies and the molding compound into a plurality of packages.