The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 23, 2017
Filed:
Sep. 09, 2013
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Inventors:
Chien Ling Hwang, Hsinchu, TW;
Yeong-Jyh Lin, Caotun Township, TW;
Bor-Ping Jang, Chu-Bei, TW;
Hsiao-Chung Liang, Hsinchu, TW;
Assignee:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/00 (2006.01); H01L 25/10 (2006.01); H01L 23/14 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 24/14 (2013.01); H01L 21/4853 (2013.01); H01L 23/147 (2013.01); H01L 23/49811 (2013.01); H01L 25/105 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32225 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/157 (2013.01); H01L 2924/1579 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15331 (2013.01); H01L 2924/181 (2013.01); H01L 2924/18161 (2013.01); H01L 2924/3841 (2013.01);
Abstract
A semiconductor device includes a substrate and a first conductive pad on a top surface of the substrate. The semiconductor device further includes a boundary structure on the top surface of the substrate around the conductive pad.