The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 20, 2022
Filed:
Dec. 24, 2018
Applicant:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Inventors:
Chung-Shi Liu, Hsinchu, TW;
Ching-Hua Hsieh, Hsinchu, TW;
Chen-Hua Yu, Hsinchu, TW;
Hsin-Hung Liao, Taipei, TW;
Chien-Ling Hwang, Hsinchu, TW;
Sung-Yueh Wu, Chiayi County, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 23/528 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 23/528 (2013.01); H01L 21/563 (2013.01); H01L 23/3128 (2013.01); H01L 24/09 (2013.01); H01L 24/17 (2013.01); H01L 24/73 (2013.01); H01L 24/97 (2013.01); H01L 2224/02373 (2013.01); H01L 2224/0401 (2013.01);
Abstract
A semiconductor package includes a semiconductor device, an encapsulating material, and a redistribution structure. The semiconductor device includes a chamfer disposed on one of a plurality of side surfaces of the semiconductor device. The encapsulating material encapsulates the semiconductor device. The redistribution structure is disposed over the encapsulating material and electrically connected to the semiconductor device.