The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 09, 2020
Filed:
Feb. 13, 2015
Applicant:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Inventors:
Chien-Ling Hwang, Hsinchu, TW;
Bor-Ping Jang, Chu-Bei, TW;
Chung-Shi Liu, Hsinchu, TW;
Hsin-Hung Liao, Taipei, TW;
Ying-Jui Huang, Zhubei, TW;
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01); H01L 23/482 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 21/60 (2006.01); H01L 21/603 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H01L 21/563 (2013.01); H01L 21/486 (2013.01); H01L 21/568 (2013.01); H01L 23/3121 (2013.01); H01L 23/4828 (2013.01); H01L 23/49827 (2013.01); H01L 23/49811 (2013.01); H01L 23/5389 (2013.01); H01L 2021/603 (2013.01); H01L 2021/6027 (2013.01); H01L 2021/60277 (2013.01); H01L 2224/16245 (2013.01); H01L 2924/181 (2013.01);
Abstract
A semiconductor package includes a carrier, at least and adhesive portion, a plurality of micro pins and a die. The carrier has a first surface and second surface opposite to the first surface. The adhesive portion is disposed on the first surface, and the plurality of the micro pins is disposed in the adhesive portions. The die is disposed on the remaining adhesive portion free of the micro pins.