The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 01, 2021

Filed:

Feb. 12, 2018
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Bor-Ping Jang, Chu-Bei, TW;

Chung-Shi Liu, Hsinchu, TW;

Chien Ling Hwang, Hsinchu, TW;

Yeong-Jyh Lin, Caotun Township, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 45/34 (2006.01); H01L 25/00 (2006.01); B29C 45/14 (2006.01); B29C 45/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/50 (2013.01); B29C 45/0046 (2013.01); B29C 45/14639 (2013.01); B29C 45/34 (2013.01); B29C 2045/0027 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A mold includes a top portion, and an edge ring having a ring-shape. The edge ring is underlying and connected to edges of the top portion. The edge ring includes air vents. The edge ring further encircles the inner space under the top portion of the mold. A plurality of injection ports is connected to the inner space of the mold. The plurality of injection ports is substantially aligned to a straight line crossing a center of the top portion of the mold. The plurality of injection ports has different sizes.


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