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For the Inventor, By the Inventor

Hsin-Chu, Taiwan

Sheng-Yu Wu

USPTO Granted Patents = 52 

Average Co-Inventor Count = 4.9

ph-index = 5

Forward Citations = 144(Granted Patents)

DiyaCoin DiyaCoin = 0.05 


Inventors with similar research interests:


Location History:

  • Hsinhcu, TW (2017)
  • Hsin-Chu, TW (2013 - 2024)

Company Filing History:

goldMedal52 out of 40,635 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2013-2024

where 'Filed Patents' based on already Granted Patents

52 patents (USPTO):
1. 11961810 - Solderless interconnection structure and method of forming same (2024-04-16),
2. 11908818 - Semiconductor device (2024-02-20),
3. 11824026 - Connector structure and method of forming same (2023-11-21),
4. 11812646 - Display device and manufacturing method thereof (2023-11-07),
5. 11658143 - Bump-on-trace design for enlarge bump-to-trace distance (2023-05-23),
6. 11315896 - Conical-shaped or tier-shaped pillar connections (2022-04-26),
7. 11239305 - Display device and manufacturing method thereof (2022-02-01),
8. 11177228 - Semiconductor device and bump formation process (2021-11-16),
9. 11152273 - Conductive structures and redistribution circuit structures (2021-10-19),
10. 11043462 - Solderless interconnection structure and method of forming same (2021-06-22),
11. 10985114 - Scheme for connector site spacing and resulting structures (2021-04-20),
12. 10861811 - Connector structure and method of forming same (2020-12-08),
13. 10734347 - Dummy flip chip bumps for reducing stress (2020-08-04),
14. 10629509 - Redistribution circuit structures and methods of forming the same (2020-04-21),
15. 10515919 - Bump-on-trace design for enlarge bump-to-trace distance (2019-12-24),

Title: Spotlight on Inventor Sheng-Yu Wu: Pioneering Innovations in Semiconductor Devices

Introduction:

Innovator Sheng-Yu Wu, hailing from Hsin-Chu, Taiwan, is a trailblazer in the field of semiconductor technology. With an impressive portfolio of 52 patents to his name, Wu has been instrumental in developing cutting-edge solutions that drive the industry forward.

Latest Patents:

Among his latest patents is the "Solderless Interconnection Structure and Method of Forming Same," a revolutionary bump on trace (BOT) structure that streamlines the interconnection process between integrated circuits and substrate traces. Wu's "Semiconductor Device" patent showcases his prowess in designing sophisticated semiconductor devices with stepped sidewall structures for enhanced performance.

Career Highlights:

Wu's illustrious career is marked by his tenure at Taiwan Semiconductor Manufacturing Company Limited (TSMC), a global leader in semiconductor manufacturing. His work at TSMC has cemented his reputation as a visionary inventor at the forefront of technological innovation.

Collaborations:

Collaborating with talented peers such as Chen-Shien Chen and Tin-Hao Kuo, Wu has fostered a culture of innovation and excellence at TSMC. Together, they have contributed to the development of groundbreaking technologies that push the boundaries of what is possible in the semiconductor industry.

Conclusion:

Inventor Sheng-Yu Wu's remarkable achievements in the field of semiconductor devices underscore his dedication to driving progress and innovation. His groundbreaking patents and collaborative spirit are a testament to his enduring impact on the industry.

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