The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 19, 2021
Filed:
Apr. 20, 2020
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Shang-Yun Tu, Hsinchu, TW;
Ching-Wen Hsiao, Hsinchu, TW;
Sheng-Yu Wu, Hsinchu, TW;
Ching-Hui Chen, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Abstract
Conductive structures and the redistribution circuit structures are disclosed. One of the conductive structures includes a first conductive layer and a second conductive layer. The first conductive layer is disposed in a lower portion of a dielectric layer, and the first conductive layer includes an upper surface with a protrusion at an edge. The second conductive layer is disposed in an upper portion of the dielectric layer and electrically connected to the first conductive layer. An upper surface of the second conductive layer is conformal with the upper surface of the first conductive layer.