The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 2020
Filed:
Dec. 06, 2011
Applicants:
Hsiu-jen Lin, Zhubei, TW;
Chung-shi Liu, Hsinchu, TW;
Ming-da Cheng, Jhubei, TW;
Chung-cheng Lin, New Taipei, TW;
Yu-peng Tsai, Taipei, TW;
Cheng-ting Chen, Taichung, TW;
Inventors:
Hsiu-Jen Lin, Zhubei, TW;
Chung-Shi Liu, Hsinchu, TW;
Ming-Da Cheng, Jhubei, TW;
Chung-Cheng Lin, New Taipei, TW;
Yu-Peng Tsai, Taipei, TW;
Cheng-Ting Chen, Taichung, TW;
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/58 (2006.01); H01L 23/00 (2006.01); H05K 3/34 (2006.01); H05K 3/28 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 24/11 (2013.01); H01L 24/81 (2013.01); H05K 3/3457 (2013.01); H01L 21/4853 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/0557 (2013.01); H01L 2224/05548 (2013.01); H01L 2224/11334 (2013.01); H01L 2224/11849 (2013.01); H01L 2224/11901 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13025 (2013.01); H01L 2224/13109 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13113 (2013.01); H01L 2224/13116 (2013.01); H01L 2224/13124 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/812 (2013.01); H01L 2224/8109 (2013.01); H01L 2224/8121 (2013.01); H01L 2224/8123 (2013.01); H01L 2224/8191 (2013.01); H01L 2224/81192 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81815 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/01327 (2013.01); H05K 3/282 (2013.01); H05K 3/3436 (2013.01); H05K 2203/043 (2013.01); H05K 2203/085 (2013.01); H05K 2203/1194 (2013.01);
Abstract
A method includes vacuum annealing on a substrate having at least one solder bump to reduce voids at an interface of the at least one solder bump. A die is mounted over the substrate.