Taiwan Semiconductor Manufacturing Comp. Ltd.

Yu-Peng Tsai

Chung-Shi Liu

Ming-Da Cheng

Hsiu-Jen Lin

Wei-Hung Lin

Meng-Tse Chen

Chun-Cheng Lin

Chih-Wei Lin

Wen-Hsiung Lu

Ching-Hua Hsieh

Kuei-Wei Huang

Wei-Yu Chen

Hao-Jan Pei

Chih-Chiang Tsao

Chia-Shen Cheng

Philip Yu-Shuan Chung

Chen-Hua Douglas Yu

Hui-Min Huang

Cheng-Ting Chen

Hsuan-Ting Kuo

Ai-Tee Ang

Bor-Ping Jang

Chia-Wei Tu

Chia-Lun Chang

Mirng-Ji Lii

Kai-Chiang Wu

Chih-Hua Chen

Yi-Wen Wu

Yu-Chih Huang

Sheng-Yu Wu

Jen-Jui Yu

Hsien-Wei Chen

Hao-Yi Tsai

Chao-Wen Shih

Ming-Che Ho

Chun-Lin Lu

Ming-Kai Liu

Tzu-Chun Tang

Sheng-Hsiang Chiu

Sheng-Feng Weng

Tsai-Tsung Tsai

Yu-Jen Tseng

Cheng-Shiuan Wong

Tuan-Yu Hung

Chung-Cheng Lin

Chun-Lung Jao

A method includes performing a first laser shot on a first portion of a top surface of a first package component. The first package component is over a second package component, and a first solder region between the first package component and the second package component is reflowed by the first laser shot. After the first laser shot, a second laser shot is performed on a second portion of the top surface of the first package component. A second solder region between the first package component and the second package component is reflowed by the second laser shot.

Bonding through multi-shot laser reflow

A manufacturing method of a package-on-package structure includes at least the following steps. Top packages are mounted on a top side of a reconstructed wafer over a flexible tape, where conductive bumps at a bottom side of the reconstructed wafer is attached to the flexible tape, and during the mounting, a shape geometry of the respective conductive bump changes and at least a lower portion of the respective conductive bump is embraced by the flexible tape. The flexible tape is released from the conductive bumps after the mounting.

Manufacturing method of package on package structure

A package structure includes an insulating encapsulation, at least one die, and conductive structures. The at least one die is encapsulated in the insulating encapsulation. The conductive structures are located aside of the at least one die and surrounded by the insulating encapsulation, and at least one of the conductive structures is electrically connected to the at least one die. Each of the conductive structures has a first surface, a second surface opposite to the first surface and a slant sidewall connecting the first surface and the second surface, and each of the conductive structures has a top diameter greater than a bottom diameter thereof, and wherein each of the conductive structures has a plurality of pores distributed therein.

Package structure and manufacturing method thereof

A method comprises forming a plurality of interconnect structures including a dielectric layer, a metal line and a redistribution line over a carrier, attaching a semiconductor die on a first side of the plurality of interconnect structures, forming an underfill layer between the semiconductor die and the plurality of interconnect structures, mounting a top package on the first side the plurality of interconnect structures, wherein the top package comprises a plurality of conductive bumps, forming an encapsulation layer over the first side of the plurality of interconnect structures, wherein the top package is embedded in the encapsulation layer, detaching the carrier from the plurality of interconnect structures and mounting a plurality of bumps on a second side of the plurality of interconnect structures.

Package-on-package structure

Package structure with porous conductive structure and manufacturing method thereof

A manufacturing method of a package-on-package structure includes at least the following steps. A plurality of conductive bumps of a first package is attached to a tape carrier. A second package is coupled to the first package opposite to the plurality of conductive bumps. When coupling the second package, the plurality of conductive bumps are deformed to form a plurality of deformed conductive bumps, and a contact area between the tape carrier and the respective deformed conductive bump increases.

An electronic device and a manufacturing method thereof are provided. The electronic device includes a chip package, an antenna pattern, and an insulating layer. The chip package includes a semiconductor die and an insulating encapsulation enclosing the semiconductor die. The antenna pattern is electrically coupled to the chip package, where a material of the antenna pattern comprises a conductive powder having fused metal particles. The insulating layer disposed between the chip package and the antenna pattern, where the antenna pattern includes a first surface in contact with the insulating layer, and a second surface opposite to the first surface, and a surface roughness of the second surface is greater than a surface roughness of the first surface.

Electronic device and manufacturing method thereof

A method includes vacuum annealing on a substrate having at least one solder bump to reduce voids at an interface of the at least one solder bump. A die is mounted over the substrate.

Method of processing solder bump by vacuum annealing

Package on-package structure

A manufacturing method of a package on package structure includes the following steps. A first package is provided on a tape carrier, wherein the first package includes an encapsulated semiconductor device, a first redistribution structure disposed on a first side of the encapsulated semiconductor device, and a plurality of conductive bumps disposed on the first redistribution structure and attached to the tape carrier. A second package is mounted on the first package through a plurality of electrical terminals by a thermo-compression bonding process, which deforms the conductive bumps into a plurality of deformed conductive bumps. Each of the deformed conductive bumps comprises a base portion connecting the first redistribution structure and a tip portion connecting the base portion, and a curvature of the base portion is substantially smaller than a curvature of the tip portion.

A method of packaging includes placing a package component over a release film, wherein solder regions on a surface of the package component are in physical contact with the release film. Next, A molding compound filled between the release film and the package component is cured, wherein during the step of curing, the solder regions remain in physical contact with the release film.

Package on-package process for applying molding compound

Package structures and methods for forming the same are provided. The package structure includes an integrated circuit die and a first shielding feature over a base layer. The package structure also includes a package layer encapsulating the integrated circuit die and the first shielding feature. The package structure further includes a second shielding feature extending from the side surface of the base layer towards the first shielding feature to electrically connect to the first shielding feature. The side surface of the second shielding feature faces away from the side surface of the base layer and is substantially coplanar with the side surface of the package layer.

Package structure and method for forming the same

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Taipei, Taiwan

Yu-Peng Tsai