The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 14, 2020
Filed:
Aug. 09, 2018
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Hsuan-Ting Kuo, Taichung, TW;
Ching-Hua Hsieh, Hsinchu, TW;
Cheng-Ting Chen, Taichung, TW;
Hsiu-Jen Lin, Hsinchu County, TW;
Hao-Jan Pei, Hsinchu, TW;
Yu-Peng Tsai, Taipei, TW;
Chia-Lun Chang, Tainan, TW;
Chih-Chiang Tsao, Taoyuan, TW;
Philip Yu-shuan Chung, Taipei, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Abstract
A manufacturing method of a package on package structure includes the following steps. A first package is provided on a tape carrier, wherein the first package includes an encapsulated semiconductor device, a first redistribution structure disposed on a first side of the encapsulated semiconductor device, and a plurality of conductive bumps disposed on the first redistribution structure and attached to the tape carrier. A second package is mounted on the first package through a plurality of electrical terminals by a thermo-compression bonding process, which deforms the conductive bumps into a plurality of deformed conductive bumps. Each of the deformed conductive bumps comprises a base portion connecting the first redistribution structure and a tip portion connecting the base portion, and a curvature of the base portion is substantially smaller than a curvature of the tip portion.