Growing community of inventors

Taipei, Taiwan

Philip Yu-Shuan Chung

Average Co-Inventor Count = 8.70

ph-index = 2

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 4

Philip Yu-Shuan ChungChing-Hua Hsieh (14 patents)Philip Yu-Shuan ChungHsiu-Jen Lin (14 patents)Philip Yu-Shuan ChungHao-Jan Pei (13 patents)Philip Yu-Shuan ChungWei-Yu Chen (11 patents)Philip Yu-Shuan ChungChia-Shen Cheng (9 patents)Philip Yu-Shuan ChungChen-Hua Douglas Yu (7 patents)Philip Yu-Shuan ChungHsuan-Ting Kuo (7 patents)Philip Yu-Shuan ChungChung-Shi Liu (6 patents)Philip Yu-Shuan ChungKuei-Wei Huang (6 patents)Philip Yu-Shuan ChungYu-Peng Tsai (6 patents)Philip Yu-Shuan ChungChih-Chiang Tsao (5 patents)Philip Yu-Shuan ChungChia-Lun Chang (5 patents)Philip Yu-Shuan ChungCheng-Ting Chen (3 patents)Philip Yu-Shuan ChungJen-Jui Yu (2 patents)Philip Yu-Shuan ChungCheng-Shiuan Wong (2 patents)Philip Yu-Shuan ChungPhilip Yu-Shuan Chung (14 patents)Ching-Hua HsiehChing-Hua Hsieh (196 patents)Hsiu-Jen LinHsiu-Jen Lin (133 patents)Hao-Jan PeiHao-Jan Pei (33 patents)Wei-Yu ChenWei-Yu Chen (230 patents)Chia-Shen ChengChia-Shen Cheng (25 patents)Chen-Hua Douglas YuChen-Hua Douglas Yu (1,928 patents)Hsuan-Ting KuoHsuan-Ting Kuo (34 patents)Chung-Shi LiuChung-Shi Liu (741 patents)Kuei-Wei HuangKuei-Wei Huang (61 patents)Yu-Peng TsaiYu-Peng Tsai (37 patents)Chih-Chiang TsaoChih-Chiang Tsao (32 patents)Chia-Lun ChangChia-Lun Chang (25 patents)Cheng-Ting ChenCheng-Ting Chen (41 patents)Jen-Jui YuJen-Jui Yu (11 patents)Cheng-Shiuan WongCheng-Shiuan Wong (10 patents)
..
Inventor’s number of patents
..
Strength of working relationships

Company Filing History:

1. Taiwan Semiconductor Manufacturing Comp. Ltd. (14 from 40,053 patents)


14 patents:

1. 12417927 - Semiconductor device and method of manufacture

2. 12368149 - Methods of forming semiconductor packages

3. 12176319 - Reflow method and system

4. 12040309 - Bonding through multi-shot laser reflow

5. 11996400 - Manufacturing method of package on package structure

6. 11942464 - Semiconductor package and method

7. 11830746 - Semiconductor device and method of manufacture

8. 11646293 - Semiconductor structure and method

9. 11610859 - Reflow method and system

10. 11462507 - Bonding through multi-shot laser reflow

11. 11342321 - Manufacturing method of package on package structure

12. 11069671 - Semiconductor package and method

13. 10790261 - Bonding through multi-shot laser reflow

14. 10535644 - Manufacturing method of package on package structure

Please report any incorrect information to support@idiyas.com
idiyas.com
as of
10/4/2025
Loading…