The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 28, 2026
Filed:
Mar. 19, 2024
Taiwan Semiconductor Manufacturing Company Limited, Hsinchu, TW;
Hsuan-Ting Kuo, Taichung City, TW;
Hsiu-Jen Lin, Zhubei City, TW;
Taiwan Semiconductor Manufacturing Company Limited, Hsinchu, TW;
Abstract
A fiber array unit (FAU) may be attached to a photonic integrated circuit (PIC) die by: disposing an end surface of the FAU on a surface of the PIC die that contains, or is proximal to, end surfaces of waveguides with the PIC die; providing a gel dispensation apparatus including a first gel supply line, a vacuum line, and a second gel supply line configured to flow a fraction of the supply flow at a terminal output flow rate toward a dispensation tip; dispensing the gel around, and onto, a periphery of an interface between the end surface of FAU and the surface of the PIC die; and curing a dispensed portion of the gel around the periphery of the interface, whereby the FAU is attached to the PIC die.