The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 30, 2023
Filed:
Dec. 26, 2019
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Chih-Chiang Tsao, Taoyuan, TW;
Chao-Wei Chiu, Hsinchu, TW;
Hsuan-Ting Kuo, Taichung, TW;
Chia-Lun Chang, Tainan, TW;
Cheng-Shiuan Wong, Hsinchu, TW;
Hsiu-Jen Lin, Zhubei, TW;
Ching-Hua Hsieh, Hsinchu, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu, TW;
Abstract
A device may include a first package and a second package where the first package has a warped shape. First connectors attached to a redistribution structure of the first package include a spacer embedded therein. Second connectors attached to the redistribution structure are fee from the spacer, the spacer of the first connectors keeping a minimum distance between the first package and the second package during attaching the first package to the second package.