The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 03, 2026
Filed:
Jan. 09, 2023
Applicant:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Inventors:
Chao-Wei Chiu, Hsinchu, TW;
Jen-Jui Yu, Taipei, TW;
Hsuan-Ting Kuo, Taichung, TW;
Cheng-Shiuan Wong, Hsinchu, TW;
Hsiu-Jen Lin, Zhubei, TW;
Ching-Hua Hsieh, Hsinchu, TW;
Assignee:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H01L 25/065 (2023.01); H01L 23/367 (2006.01);
U.S. Cl.
CPC ...
H01L 24/13 (2013.01); H01L 21/4853 (2013.01); H01L 23/49816 (2013.01); H01L 24/11 (2013.01); H01L 25/0652 (2013.01); H01L 25/0655 (2013.01); H01L 23/3675 (2013.01); H01L 23/49833 (2013.01); H01L 24/05 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05655 (2013.01); H01L 2224/05664 (2013.01); H01L 2224/11849 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13113 (2013.01); H01L 2224/13117 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/29193 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29324 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/29347 (2013.01); H01L 2224/29386 (2013.01); H01L 2224/32245 (2013.01); H01L 2924/01032 (2013.01); H01L 2924/014 (2013.01); H01L 2924/0503 (2013.01); H01L 2924/05032 (2013.01); H01L 2924/0543 (2013.01);
Abstract
Semiconductor devices including the use of solder materials and methods of manufacturing are provided. In embodiments the solder materials utilize a first tensile raising material, a second tensile raising material, and a eutectic modifier material. By utilizing the materials a solder material can be formed and used with a reduced presence of needles that may otherwise form during the placement and use of the solder material.