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For the Inventor, By the Inventor

Kaohsiung, Taiwan

Mao-Yen Chang

This inventor holds 19 USPTO granted patents and 21 published patent applications. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2019-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Mao-Yen Chang. Retrieved from https://idiyas.com/inventor/mao-yen-chang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 19 

% Patents Active = 100.0

Average Co-Inventor Count = 8.4

ph-index = 2

Forward Citations = 11(Granted Patents)


Company Filing History:

goldMedal19 out of 42,810 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2019-2026

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19 patents (USPTO):Explore Patents
1. 12642119 - Chip package structure including a silicon substrate interposer and methods for forming the same (2026-05-26),
2. 12538827 - Semiconductor structure (2026-01-27),
3. 12525501 - Semiconductor device (2026-01-13),
4. 12512451 - Semiconductor package and manufacturing method of the same (2025-12-30),
5. 12500219 - Trimming and sawing processes in the formation of wafer-form packages (2025-12-16),
6. 12406961 - Integrated circuit package and method (2025-09-02),
7. 12374592 - Semiconductor device and manufacturing method thereof (2025-07-29),
8. 12278208 - Method of fabricating semiconductor structure including a barrier structure in between a plurality of surface mount components and a wafer (2025-04-14),
9. 12166015 - Semiconductor package and manufacturing method of semiconductor package (2024-12-10),
10. 12107064 - Semiconductor package and manufacturing method thereof (2024-10-01),
11. 12014976 - Chip package structure including a silicon substrate interposer and methods for forming the same (2024-06-18),
12. 11942451 - Semiconductor structure and method of forming the same (2024-03-26),
13. 11848300 - Semiconductor structure including a semiconductor wafer and a surface mount component overhanging a periphery of the semiconductor wafer (2023-12-19),
14. 11646296 - Semiconductor package and manufacturing method of semiconductor package (2023-05-09),
15. 11646255 - Chip package structure including a silicon substrate interposer and methods for forming the same (2023-05-09),

Title: The Innovative Journey of Inventor Mao-Yen Chang

Introduction: Mao-Yen Chang, a distinguished inventor hailing from Kaohsiung, Taiwan, has made significant contributions to the field of innovation with his groundbreaking ideas and inventions.

Latest Patents: Mao-Yen Chang holds several patents in various technological domains, showcasing his continuous commitment to pushing the boundaries of innovation.

Career Highlights: Throughout his illustrious career, Mao-Yen Chang has been recognized for his exceptional problem-solving skills and creative thinking, leading to the development of cutting-edge technologies that have revolutionized industries.

Collaborations: Mao-Yen Chang has collaborated with leading research institutions, universities, and companies worldwide, fostering a culture of innovation and knowledge exchange that has propelled his inventions to new heights.

Conclusion: Mao-Yen Chang's relentless pursuit of innovation and his passion for creating solutions to complex challenges have solidified his position as a visionary inventor, inspiring the next generation of innovators to dream big and think outside the box.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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