Ching-Jung Yang

This inventor holds 70 USPTO granted patents and 7 published patent applications, primarily in Semiconductor Packaging (CPC class H01L). Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Raydium Semiconductor Corporation, Au Optronics Corporation. Active years: 2011-2026.

USPTO Granted Patents = 70 (Patent Applications = 7)

% Patents Active = 80.0

Average Co-Inventor Count = 3.7

ph-index = 8

Forward Citations = 183(Granted Patents)

Forward Citations (Not Self Cited) = 146(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Hsinchu, TW (2011 - 2013)
Pingzhen, TW (2012 - 2023)
Taoyuan County, TW (2013 - 2023)
Taoyuan, TW (2016 - 2023)

Company Filing History:

67 out of 42,679

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

2 out of 186

Raydium Semiconductor Corporation

patents

1 out of 4,577

Au Optronics Corporation

patents

Years Active: 2011-2026

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Areas of Expertise:

Semiconductor Structure

Die Stack Structure

Conductive Bump

Anti-Arcing Pattern

3DIC Structure

Integrated Circuit

Metal Layers

Probe Pad

Packaging Methods

Hybrid Bonding

Protective Structure

Solder Regions

70 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12648459 - Semiconductor device and manufacturing method thereof (2026-06-02),

2. 12444714 - Semiconductor structure (2025-10-14),

3. 12374652 - Packages for semiconductor devices, packaged semiconductor devices, and methods of packaging semiconductor devices (2025-07-29),

4. 12362282 - Semiconductor structure and manufacturing method thereof (2025-07-15),

5. 12322728 - Method of manufacturing die stack structure (2025-06-03),

6. 12278199 - Conductive bump of a semiconductor device and fabricating method thereof cross reference to related applications (2025-04-14),

7. 12211823 - Semiconductor package with shared barrier layer in redistribution and via and method of manufacturing the same (2025-01-28),

8. 12205856 - Semiconductor structure including interconnection to probe pad with probe mark (2025-01-21),

9. 12176257 - Semiconductor structure having an anti-arcing pattern disposed on a passivation layer (2024-12-24),

10. 11837579 - Semiconductor structure (2023-12-05),

11. 11837562 - Conductive bump of a semiconductor device and fabricating method thereof (2023-12-05),

12. 11784124 - Plurality of different size metal layers for a pad structure (2023-10-10),

13. 11769704 - Semiconductor structure having an anti-arcing pattern disposed on a passivation layer and a post passivation layer disposed on the anti-arcing pattern (2023-09-26),

14. 11682594 - Semiconductor structure including interconnection to probe pad with probe mark (2023-06-20),

15. 11562935 - Semiconductor structure (2023-01-24),

Title: The Innovative Journey of Ching-Jung Yang

Introduction: Ching-Jung Yang, a talented inventor hailing from Pingzhen, Taiwan, has made significant contributions to the field of technology with his groundbreaking inventions.

Latest Patents: Ching-Jung Yang holds several patents in the areas of electronics and renewable energy, showcasing his continuous commitment to innovation and creativity.

Career Highlights: Throughout his illustrious career, Ching-Jung Yang has been recognized for his pioneering work in developing sustainable energy solutions and cutting-edge electronic devices. His inventions have not only improved the quality of life for many but have also paved the way for a more sustainable future.

Collaborations: Ching-Jung Yang has collaborated with leading research institutions and technology companies to further advance his inventions and bring them to the market. His collaborative efforts have led to the successful implementation of his innovative ideas in various industries.

Conclusion: In conclusion, Ching-Jung Yang's passion for innovation and his dedication to creating impactful inventions have solidified his reputation as a visionary inventor. His contributions to the world of technology continue to inspire future generations of inventors and innovators.