The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 02, 2026
Filed:
Jul. 05, 2023
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Ching-Jung Yang, Taoyuan City, TW;
Hsien-Wei Chen, Hsinchu City, TW;
Ming-Fa Chen, Taichung City, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Abstract
A semiconductor device includes a metallic pattern provided above a substrate and extending in a first direction with a first width, a first active metallic feature directly connected to the metallic pattern and extending in a second direction from the metallic pattern with a second width that is smaller than the first width, and a first dummy metallic feature arranged adjacently to the first active metallic feature. The first dummy metallic feature is directly connected to the metallic pattern and extends in the second direction from the metallic pattern while not electrically connected to lines other than the metallic pattern.