The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2026

Filed:

May. 25, 2023
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Tung-Liang Shao, Hsinchu, TW;

Yu-Sheng Huang, Hemei Township, TW;

Chen-Hua Yu, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/14 (2006.01); G02B 6/42 (2006.01);
U.S. Cl.
CPC ...
G02B 6/428 (2013.01); G02B 6/4214 (2013.01); G02B 6/4243 (2013.01); G02B 6/4238 (2013.01);
Abstract

A method includes forming an optical engine including a photonic integrated circuit die, wherein the photonic integrated circuit die includes an optical component, forming an adapter comprising a laser written waveguide, and assembling the optical engine, the adapter, and an optical fiber as a package. The optical fiber is optically coupled to the optical component through the laser written waveguide in the adapter.


Find Patent Forward Citations

Shao, Tung-Liang. (2026). Optical coupling adapter for fiber-to-chip integration (U.S. Patent No. 12761432). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12761432

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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