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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12622271 B1

PDFFull Text
Date of Patent:
May. 05, 2026

Filed:

Jun. 27, 2022

Cooling cover and packaged semiconductor device including the same

Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Chung-Jung Wu, Hsinchu, TW;

Sheng-Tsung Hsiao, Taoyuan, TW;

Jen Yu Wang, Hsinchu, TW;

Tung-Liang Shao, Hsinchu, TW;

Chih-Hang Tung, Hsinchu, TW;

Assignee:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Attorney:

Slater Matsil, LLP

Primary Examiner:

Dale E Page

Assistant Examiner:

Cristian A Tivarus

Int. Cl.
CPC ...
H01L 23/367 (2006.01); H01L 23/00 (2006.01); H01L 23/40 (2006.01); H01L 23/473 (2006.01); H01L 23/498 (2006.01); H01L 25/065 (2023.01);
U.S. Cl.
CPC ...
H01L 23/473 (2013.01); H01L 23/4006 (2013.01); H01L 25/0655 (2013.01); H01L 2023/405 (2013.01); H01L 2023/4087 (2013.01); H01L 23/49833 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/96 (2013.01); H01L 24/97 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/1011 (2013.01); H01L 2924/10158 (2013.01); H01L 2924/15311 (2013.01);
Abstract

Cooling covers including trapezoidal cooling chambers for cooling packaged semiconductor devices and methods of forming the same are disclosed. In an embodiment, a cooling cover for a semiconductor device includes an inlet; an outlet; and a cooling chamber in fluid communication with the inlet and the outlet, the cooling chamber having a trapezoidal shape in a cross-sectional view.

Find Patent Forward Citations

Wu, Chung-Jung. (2026). Cooling cover and packaged semiconductor device including the same (U.S. Patent No. 12622271). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12622271

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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