Hsinchu, Taiwan

Chih-Hang Tung

This inventor holds 90 USPTO granted patents and 25 published patent applications, primarily in Semiconductor Packaging (CPC class H01L25-0657). Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Taiwan Semiconductor Manufacturing Co., Ltd.. Active years: 2012-2026.

USPTO Granted Patents = 90 

% Patents Active = 77.8

Average Co-Inventor Count = 4.2

ph-index = 10

Forward Citations = 515(Granted Patents)

Forward Citations (Not Self Cited) = 446(Dec 10, 2025)


Inventors with similar research interests:

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Location History:

  • Singapore, SG (2012)
  • Chu-Pei, TW (2018 - 2020)
  • Hsinchu County, TW (2019 - 2022)
  • Hsin-Chu, TW (2013 - 2024)

Company Filing History:


Years Active: 2012-2026

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Areas of Expertise:
Semiconductor Package
Die Stacking
Thermal Interface
Integrated Fan-Out
Bonding Method
Cooling Structure
3D Magnetic Core Inductor
Liquid-Cooled Lid
Interconnect Structure
Redistribution Layer
Manufacturing Method
Bonded Devices
90 patents (USPTO):Explore Patents

Title: Innovations of Chih-Hang Tung: Patents and Collaborations in Semiconductor Technology

Introduction: Chih-Hang Tung, a prominent inventor based in Hsinchu, Taiwan, has made significant contributions to the field of semiconductor technology with an impressive portfolio of 78 patents. His work is characterized by innovative methods and structures that enhance the functionality and efficiency of electronic devices.

Latest Patents: Among Chih-Hang Tung's latest patents is the "Integrated fan-out package with 3D magnetic core inductor." This patent describes a method of fabricating an integrated electronic device package involving the formation of electrically conductive traces on an insulating layer, the creation of vias in a sacrificial layer, and the formation of a magnetic structure embedded within a molding material. The design includes a coil-shaped electrically conductive trace that encircles the magnetic structure, ultimately forming an inductor with improved performance. Another noteworthy patent is the "Packaged semiconductor device and method of forming thereof," which includes a unique construction of stacked dies to enhance semiconductor device functionality.

Career Highlights: Chih-Hang Tung currently works at Taiwan Semiconductor Manufacturing Company Limited, a leading organization in the semiconductor industry. His career is marked by numerous advancements in the design and production of semiconductor devices, focusing on optimizing their performance and manufacturability.

Collaborations: Tung's innovative work has included collaborations with notable colleagues such as Chen-Hua Douglas Yu and Tung-Liang Shao. These partnerships emphasize the importance of teamwork in driving technological advancement within the semiconductor sector.

Conclusion: Chih-Hang Tung's contributions to semiconductor technology underscore his role as an influential inventor in the field. With an extensive patent portfolio showcasing groundbreaking innovations, his work not only advances the state of semiconductor manufacturing but also sets a foundation for future developments in electronic device packaging and design.

Profile summary based on public USPTO records.
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