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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12132074 B1

PDFFull Text
Date of Patent:
Oct. 29, 2024

Filed:

Apr. 24, 2023

Package

Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Wen-Shiang Liao, Miaoli County, TW;

Chih-Hang Tung, Hsinchu, TW;

Assignee:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Attorney:

JCIPRNET

Primary Examiner:

Nitin Parekh

Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01F 27/24 (2006.01); H01F 27/28 (2006.01); H01F 41/04 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
H01L 28/10 (2013.01); H01F 27/24 (2013.01); H01F 27/2804 (2013.01); H01F 41/041 (2013.01); H01L 21/4857 (2013.01); H01L 21/486 (2013.01); H01L 21/561 (2013.01); H01L 21/565 (2013.01); H01L 21/568 (2013.01); H01L 21/6835 (2013.01); H01L 23/3128 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 24/97 (2013.01); H01F 2027/2809 (2013.01); H01L 2224/211 (2013.01); H01L 2224/221 (2013.01); H01L 2224/95001 (2013.01); H01L 2924/1427 (2013.01); H01L 2924/19042 (2013.01);
Abstract

A package includes a first redistribution structure, a second redistribution structure, an inductor, a permalloy core, and a die. The second redistribution structure is over the first redistribution structure. The inductor includes a first portion, a second portion, and a third portion. The first portion is embedded in the first redistribution structure, the third portion is embedded in the second redistribution structure, and the second portion connects the first and third portions of the inductor. The permalloy core is located between the first and third portions of the inductor. The die is disposed adjacent to the second portion of the inductor.

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